Cranes Software Inc.: NISA
Cranes Software Inc.
1133 E. Maple Road
Suite 103
Troy, MI 48083
United States
Web: http://www.nisasoftware.com
Email: vkinariwala@nisasoftware....
Phone: (248) 689-0077 x314
Fax: (248) 689-7479
Product Details:
NISA is a suite of programs for structure analysis (static and dynamic), heat transfer analysis, 3D fluid flow analysis, fatigue and fracture analysis, electromagnetic analysis, multibody mechanical system analysis, structural and shape optimization, and analysis of printed circuit board and field problems. NISA supports iterative and spare solvers along with support for multiple CPU hardware. It is completely interfaced with the geometric and FEA modeling program, DISPLAY III/IV. It consists of the following modules:
NISA II - Linear and nonlinear static analysis, Eigen value calculation, buckling analysis
Advanced dynamics - modal and direct (linear and nonlinear) transient dynamics, frequency response, random vibration, shock spectrum analysis and component mode synthesis steady state and transient heat transfer analysis
DISPLAY III/IV - Interactive graphics program for geometry and finite element model building, analysis preparation, and post-processing, including interfaces to the majority of commercially available CAD systems
New advanced mesher allows users to create both surface and volume mesh directly on the translated geometries
NISA/COMPOSITES - FEA program for laminated composite structures (linear and nonlinear)
ENDURE—Fatigue and Fracture analysis program NISAOPT - Shape & structural optimization of 3D structure and beam optimization
NISA/EMAG - Electric and magnetic field analysis of electromagnetic devices
NISA/3D-FLUID - FE based 2D and 3D fluid flow analysis with conjugate heat transfer (compressible and incompressible)
NISA/ACOUSTICS - Acoustics analysis to predict the sound radiation, scatter, and transmission in finite and infinite domains
DYMES - Kinematic & dynamic analyses of mechanical systems
FEAP - Static, dynamic, heat transfer, fluid flow, and fatigue life predictions of single and multiple printed circuit boards (PCBs) and electronic systems. All the above programs are available for both Windows® and Linux operating systems.
Features:
- Fully integrated CAE solution
- Analysis of composite stuctures
- Seismic analysis
- Coupled electro-thermal analysis
Benefits:
- Many analysis types from a single vendor
- Easy to use and very powerful functionality
- Earthquake certification
- More accurate electromagnetic and thermal modeling





