Enhancing Electronics Reliability with Thermal-Structural Coupled Analysis

Watch now as we explore how to perform thermal-structural coupled analysis using electromagnetics and structural simulation tools.

You’ll learn how to:

• Accurately model heat sources from electronic components
• Define realistic convection and boundary conditions
• Transfer thermal results into structural studies to evaluate thermal stresses, warpage, & fatigue life of assemblies

We also demonstrate workflows that connect electromagnetic losses to temperature rise and structural response, enabling engineers to predict failure risks early in the design cycle.

You will walk away from this on-demand webinar with the knowledge and confidence to set up coupled studies, interpret results, and apply simulation insights to improve design robustness, reduce prototyping cycles, and meet reliability targets.

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